Technical advantages
High vacuum degree
Low leakage rate
High safety
Rigorous and complete, slot valve/process module/robot,
Hardware interlock design,
Benchmarking against international first-tier brands,
Through SemiS2 safety certification specifications and parameters.
Multifunctional customization
Supports 100/150/200/300mm wafer transmission function,
Customizes software and functions according to client requirements.
After-sales service
Local technical and service teams with quick response.
VTM300-HH600
VTM300-HH600
Product Image
VTM Drawing
Left view
Right view
Top view
Front view
Specification
| Basic | Power Supply | AC 220V 50Hz 1500W | |
| CDA | 0.3-0.7MPa | ||
| Platform | 1100mm | ||
| Wafer Size | 300mm 200mm 150mm 100mm | ||
| Cleanliness | Class 1 | ||
| Base Vacuum | 5 x 10(−8) Torr | ||
| Leak Rate | <1 x 10(−9)std.cc/sec He | ||
| Robot | Model | HHVRD32 | |
| Range of Motion | R-axis | 1050mm | |
| Z-axis | 50mm 100mm 150mm | ||
| Maximum transfer speed | 1000mm/sec | ||
| Repeatability | R-axis、Z-axis | ± 0.05mm | |
| T-axis | 0.005° | ||
| VPA | Calibration Accuracy | Rotational Alignment Repeatability | 0.3° (3σ) |
| Centering Repeatability | 0.05mm | ||
| Initial Capture Range | +3.99mm | ||
| Alignment Period | 3.5-4.7sec | ||
| VCE | Key features | Detection of laminations or oblique plates | |
| Cassette Mapping Period | 20sec | ||